Hybrid Micro Circuits, Thick Film Hybrid Micro Circuits ( HMC ) For Payload, Control And Communication Subsystems, Space & Military Grade Thick Film Hybrid DC-DC Converters And Electronics Power Conditioners, PCB Assembly, High Voltage Thick Film Resistors, Precision Resistor Dividers, Avionics Modules With Leaded Components, High Quality Sensor Nodes Including High Sensitivity Motion Sensor, Photodetectors And Own Intellectual Property, GTMS Package ( Glass To Metal Seal ), Metal Caps, Hermetic Sealing, Glass Beads With Pin And Package, Nickel And Gold Plating, Advanced Microelectronic Substrates, Semiconductor Packaging / Advanced Packaging, Thick Film Substrates, Thin Film Substrates (TNFS), High-Temperature Co-fired Ceramics (HTCC), Low Temperature Co-Fire Ceramics (LTCC) Substrates, Direct Copper Bonded Substrates.